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Asia-Pacific Bluetooth Modules Market Analysis 2012-2017 and Forecast 2018-2023


Summary

Snapshot
Bluetooth is a global wireless communication standard that connects devices together over a certain distance. Think headset and phone, speaker and PC, basketball to smartphone and more. A Bluetooth module is usually a hardware component that provides a wireless product to work with the computer; or in some cases, the Bluetooth may be an accessory or peripheral, or a wireless headphone or other product (such as cellphones can use.)
The Asia-Pacific Bluetooth Modules market will reach xxx Million USD in 2018 and CAGR xx% 2018-2023. The report begins from overview of Industry Chain structure, and describes industry environment, then analyses market size and forecast of Bluetooth Modules by product, region and application, in addition, this report introduces market competition situation among the vendors and company profile, besides, market price analysis and value chain features are covered in this report.
Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):
Bluetooth Low Energy (BLE) Modules
Dual-mode Bluetooth Modules
Classic Bluetooth Modules
Company Coverage (Sales Revenue, Price, Gross Margin, Main Products etc.):
Murata
Qualcomm
Intel
Broadcom
Panasonic
Texas Instruments
Fujitsu
Hosiden
STMicroelectronics
Laird
Taiyo Yuden
Cypress Semiconductor
Microchip Technology
Silicon Labs
Application Coverage (Market Size & Forecast, Different Demand Market by Region, Main Consumer Profile etc.):
Mobile Phones
Computers
Connected Home
Others
Region Coverage (Regional Production, Demand & Forecast by Regions etc.):
China
Japan & Korea
India
Southeast Asia
Oceania

Table of Contents

Table of Content
1 Industry Overview
1.1 Bluetooth Modules Industry
1.1.1 Overview
1.1.2 Development of Bluetooth Modules
1.2 Market Segment
1.2.1 By Product Type
1.2.2 By Application
1.3 Asia-Pacific Overview
2 Major Companies List
2.1 Murata (Company Profile, Products & Services, Sales Data etc.)
2.2 Qualcomm (Company Profile, Products & Services, Sales Data etc.)
2.3 Intel (Company Profile, Products & Services, Sales Data etc.)
2.4 Broadcom (Company Profile, Products & Services, Sales Data etc.)
2.5 Panasonic (Company Profile, Products & Services, Sales Data etc.)
2.6 Texas Instruments (Company Profile, Products & Services, Sales Data etc.)
2.7 Fujitsu (Company Profile, Products & Services, Sales Data etc.)
2.8 Hosiden (Company Profile, Products & Services, Sales Data etc.)
2.9 STMicroelectronics (Company Profile, Products & Services, Sales Data etc.)
2.10 Laird (Company Profile, Products & Services, Sales Data etc.)
2.11 Taiyo Yuden (Company Profile, Products & Services, Sales Data etc.)
2.12 Cypress Semiconductor (Company Profile, Products & Services, Sales Data etc.)
2.13 Microchip Technology (Company Profile, Products & Services, Sales Data etc.)
2.14 Silicon Labs (Company Profile, Products & Services, Sales Data etc.)
3 Market Competition
3.1 Company Competition
3.2 Regional Market by Company
4 Bluetooth Modules Market by Type
4.1 By Type
4.1.1 Bluetooth Low Energy (BLE) Modules
4.1.2 Dual-mode Bluetooth Modules
4.1.3 Classic Bluetooth Modules
4.2 Market Size
4.3 Market Forecast
5 Market Demand
5.1 Demand Situation
5.1.1 Demand in Mobile Phones
5.1.2 Demand in Computers
5.1.3 Demand in Connected Home
5.1.4 Demand in Others
5.2 Regional Demand Comparison
5.3 Demand Forecast
6 Region Operation
6.1 Regional Production
6.2 Regional Market
6.3 by Region
6.3.1 China
6.3.1.1 By Type
6.3.1.2 By Application
6.3.2 Japan & Korea
6.3.2.1 By Type
6.3.2.2 By Application
6.3.3 India
6.3.3.1 By Type
6.3.3.2 By Application
6.3.4 Southeast Asia
6.3.4.1 By Type
6.3.4.2 By Application
6.3.5 Oceania
6.3.5.1 By Type
6.3.5.2 By Application
6.4 Regional Forecast
7 Marketing & Price
7.1 Price and Margin
7.1.1 Price Trends
7.1.2 Factors of Price Change
7.1.3 Manufacturers Gross Margin Analysis
7.2 Marketing Channel
8 Upstream & Cost
8.1 Upstream
8.2 Cost
9 Industry Environment
9.1 Policy
9.2 Economics
9.3 Sociology
9.4 Technology
10 Research Conclusion

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